O***p
发帖数: 1333 | 1 我刚刚进入CFD的领域，没有用过像Flotherm或者Icepak复杂的软件，因为我是搞强电的
，我的老板对CFD方面也不懂，我想请问懂这方面的人哪个软件更适合模拟IC level，比
如几个芯片放在一些substrate上再用heat sink或者water cooling的温度反映。如果有
用过2者的，请做一下比较。多谢。 |
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O***p
发帖数: 1333 | 2 这里有没有人用过Flotherm或IcePak,可以谈谈经验么？
的
比
有 |
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m****y
发帖数: 14 | 3 我们组里有icepak，但我却没时间去摸
其实它就是Fluent的一个分支包装而已。
模块做的比较适合做封装的热设计。
Flotherm听说过，却没见过，但你说的
东西我觉得两者做都可以，很基本的一些
设计。 |
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P***A
发帖数: 483 | 4 I have used icepak before. Following example problem will be a good start. |
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r*f
发帖数: 39119 | 5 还有酸奶，另外如果出去时间长还得带cooler和icepak什么的，需要冰箱冰icepak |
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j****x
发帖数: 943 | 6 On the contrary, I think FEM or FVM simulation and modeling using IcePak,
Flotherm or Fluent is a great plus for job hunting per se. It is true that
not many nanoscale heat transfer openings on the job market, however,
engineers in many electronics cooling related industries are hiring. If LZ
want to go for academia, I think these are not bad areas to delve into.
to
IcePak,
the |
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i****a
发帖数: 88 | 7 自己顶一下，已经搞定， 其实stiffness和 damping matrices都可以从ANSYS的 .full文件抽取出来，并不一定要用.emat
文件。
另外，ANSYS建模太麻烦， 今天搞定了用Fluent从Icepak里把model的elements&nodes导入ANSYS来提取系统矩阵。现
在原本Icepak里半个小时transient simulation在matlab里用MOR不到一分钟就得到结果了。坏处是现在每天工作量连15
分钟也没有了。 |
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i****a
发帖数: 88 | 8 自己顶一下，已经搞定， 其实stiffness和 damping matrices都可以从ANSYS的 .full文件抽取出来，并不一定要用.emat
文件。
另外，ANSYS建模太麻烦， 今天搞定了用Fluent从Icepak里把model的elements&nodes导入ANSYS来提取系统矩阵。现
在原本Icepak里半个小时transient simulation在matlab里用MOR不到一分钟就得到结果了。坏处是现在每天工作量连15
分钟也没有了。 |
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m***d
发帖数: 269 | 9 mechanical engineering PhD，做electronics cooling devices/systems 的设计和研发
动手能力强，会IcePak
在一公司工作了3年，想换工作，有绿卡
想去加州，求推荐，站内联系，多谢！！ |
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j*****a
发帖数: 51 | 10 please send your resume to my mailbox, fill in immediately!
Job Description • IC package thermal modeling, thermal design, and
thermal characterization • Develope advanced thermal management
technologies for IC packaging and electronic systems • Electronic
system thermal modeling, thermal design, and form-factor thermal evaluation
• Perform product verification and customer application system thermal
tests • Technical support to internal and external customers on
ap... 阅读全帖 |
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m***d
发帖数: 269 | 11 【 以下文字转载自 JobHunting 讨论区 】
发信人: mbond (mbond), 信区: JobHunting
标 题: 想换工作了，求推荐， electronics cooling背景
发信站: BBS 未名空间站 (Mon Oct 8 22:56:07 2012, 美东)
mechanical engineering PhD，做electronics cooling devices/systems 的设计和研发
动手能力强，会IcePak
在一公司工作了3年，想换工作，有绿卡
想去加州，求推荐，站内联系，多谢！！ |
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h*****t
发帖数: 56 | 12 medela的那个icepak就可以，先冻硬，然后跟奶放袋子里，可以保存24小时。 |
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l********2
发帖数: 200 | 13 breastpump 不是自带了icepak 吗？在用一个lunch bag.. |
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l********2
发帖数: 200 | 14 你的ob或医院没送icepak包?
★ Sent from iPhone App: iReader Mitbbs Lite 7.56 |
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m***d
发帖数: 269 | 15 【 以下文字转载自 JobHunting 讨论区 】
发信人: mbond (mbond), 信区: JobHunting
标 题: 想换工作了，求推荐， electronics cooling背景
发信站: BBS 未名空间站 (Mon Oct 8 22:56:07 2012, 美东)
mechanical engineering PhD，做electronics cooling devices/systems 的设计和研发
动手能力强，会IcePak
在一公司工作了3年，想换工作，有绿卡
想去加州，求推荐，站内联系，多谢！！ |
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n***s
发帖数: 48 | 16 半导体这类的我还真没接触过 是类似MEMS之类的微尺度分析么？
以前只接触过电子元件散热 基本icepak flowtherm就行了 基本傻瓜化了 所以觉得没
技术含量 |
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j*****a
发帖数: 51 | 17 send your resume to my inbox, need to fill the position quick.
Job Description • IC package thermal modeling, thermal design, and
thermal characterization • Develope advanced thermal management
technologies for IC packaging and electronic systems • Electronic
system thermal modeling, thermal design, and form-factor thermal evaluation
• Perform product verification and customer application system thermal
tests • Technical support to internal and external customers on... 阅读全帖 |
|
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t*n
发帖数: 14458 | 19 why do you want ot do CFD?
there is no fluid flow involved in your problem i believe. pure heat conduction. |
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O***p
发帖数: 1333 | 20 CFD helps determin the convection HTC for the geometry. I did modeling in
Patran and I had to manually input the convection coefficient for the
geometry, which I hated so much because you know how difficult that is to do
with a finned heat sink, and when you have a pin-fin array heat sink, just
forget it.
Conduction only applies within the package. Convection and radiation is the
way to remove heat into ambient air. That's why I think CFD software is needed
conduction.
电的
，比
果有 |
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h****l
发帖数: 7290 | 21 计算热对流不简单的，搞电的还是不要自己算了，都不知道对错 |
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P*******9
发帖数: 113 | 22 ANSYS has thermal modeling function. If used for electronic cooling, its
function is not good.
Icepak and Flotherm are best. |
|
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r***l
发帖数: 9084 | 24 9iv.com看看,估计要交点钱,但很便宜.
或者电驴搜索,应该有. |
|
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F**D
发帖数: 6472 | 26 generally ee is better than me in terms of job hunting.
for your focus, it depends on the application of your research on heat trans
fer. If you apply it into electronic circuit or something like it, it might
be easy for you to secure a position. For example, experts on Icepak are
very
popular. |
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i****a
发帖数: 88 | 27 The thermal characterization for micro/nanodevices, e.g., electrical and
optical thermometry in frequency and time-domain can be directly applied to
conventional heat transfer systems.
I won't recommend the modeling, or even FEM and FVM simulation using IcePak,
etc. You don't want to spend your time sitting there running non-sense
simulation just because high-level guys want to see nice plots. Those
simulation jobs are more suitable for Master level.
As to the job market, nanoscale heat transfer |
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c****w
发帖数: 565 | 28 大牛能给说说工业界PhD能干点什么高难度的活么
to
IcePak,
the |
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j*******j
发帖数: 150 | 29 Good post! Support!
Most nano heat transfer guys from famous group end up with some faculty
position
It is a relatively popular branch in ME for many department which would like
expand their research areas. On the other hand, industry job market is
limiting.
to
IcePak,
the |
|
l*******n
发帖数: 101 | 30 how's nano heat transfer compared with graphene fabrication in job market?
Should I go back to
graphene?
and how about TE for auto energy scavenging?
to
IcePak,
the |
|
i****a
发帖数: 88 | 31 You can use any software, like ANSYS or Icepak or other softwares for 2/3-D
problem.
There are two ways to model TEC cooler module:
(1) Use ANSYS thermoelectric element, but it is only suitable for a single
pellet element device modeling.
(2) Using an equivalent temperature-dependent heat source at cold and hot
sides to model the thermoelectric effect. If you want to determine the
electric current need to maintain certain cold side temperature, have to use
iteration method, to get the desired I. |
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i****a
发帖数: 88 | 32 AMD is hurry in looking for a Ph.D level people with background in ME on
electronics cooling. Will deal with component and system level thermal
solution development of high power microprocessors.
Desired skills:
Thermal modeling using those stupid icepak & flothem tools.
Experimental skills in thermal & electrical measurement.
Deep understanding of heat transfer from mechanical, electrical, and
material science point of view.
This position needs to be filled in two months.
Let me know if you are... 阅读全帖 |
|
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s********y
发帖数: 979 | 34 是ansys 12.1里有的吧？
里面有教程啊，帮助打开后，把例子全做一遍，估计就差不多了吧。 |
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