h*******y
发帖数: 896 | 1 If your background matches this position, please send me your resume
(email needed).
========================
Job Posting: Jan 6, 2011
Primary Location: US-AZ-Tempe (AZ34)
Job: Packaging
Education Level: Bachelor's Degree
Job Type: Experienced
Qualifications:
-BS in Materials Engineering/Related with 5 years experience in
semiconductor packaging or related field required. MS/PhD with experience
preferred.
-Specific knowledge in multi-chip module (MCM) assembly, wafer level
packaging or 3D advanced packaging is highly preferred.
-An experienced, innovative, development minded engineer with a strong
material science background.
-Emphasis in materials selection and process development with a disciplined
approach to conducting experiments (DOE)
-Strong written and verbal presentation skills required. | P******e
发帖数: 344 | 2 is this Intel or ON or Freescale?
【在 h*******y 的大作中提到】
: If your background matches this position, please send me your resume
: (email needed).
: ========================
: Job Posting: Jan 6, 2011
: Primary Location: US-AZ-Tempe (AZ34)
: Job: Packaging
: Education Level: Bachelor's Degree
: Job Type: Experienced
: Qualifications:
: -BS in Materials Engineering/Related with 5 years experience in
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