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ME版 - job opening at qualcomm
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1 (共1页)
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发帖数: 111
1
There are quite a few openings posted recently. Please apply through
Qualcomm web site.
Need knowledge on Solid mechanics + ABAQUS + package assembly process
#: G1844121
Job Title Thermal/Mechanical IC Engineer
Post Date 10/8/2009
Division QCT
Job Area Engineering - Hardware
Location California - San Diego
Job Description The candidate will contribute to the development and
implementation of solutions for managing thermal and mechanical challenges
in leading edge SoC/SiP IC products, including
1 (共1页)
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