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Macromolecules版 - Intel position openings
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1 (共1页)
d***a
发帖数: 73
1
If interested, please respond to my email inbox. thx
(1) RCG Sr. Packaging Engineer
Description
In this position, you will be responsible for the development and
certification of fluxes (water soluble, no clean, solder pastes) for a
variety of packaging applications. You will also be responsible for leading
efforts to develop, integrate, and certify materials and suppliers in
support of assembly packaging development and High Volume Manufacturing (HVM
) readiness for Intel's CPU and chipset tec
1 (共1页)
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