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发帖数: 5 | 1 Understanding the electrothermal-mechanical behavior of electronic
interconnects is of practical importance in improving the structural
reliability of electronic devices. In this work, we use the finite-element
method to analyze the Joule-heating-induced thermomechanical deformation of
a metallic sphere that is sandwiched between two rigid plates. The
deformation behavior of the sphere is elastic–perfectly plastic with Young
’s modulus and yield stress decreasing with temperature. The mechanical
stresses created by Joule heating are found to depend on the thermal and
mechanical contact conditions between the sphere and the plates. The
temperature rise in the sphere for the diathermal condition between the
sphere and the plates deviates from the square relation between Joule heat
and electric current, due to the temperature dependence of the
electrothermal properties of the material. For large electric currents, the
simulations reveal the decrease of von Mises stress near the contact
interfaces, which suggests that current-induced structural damage will
likely occur near the contact interfaces. |
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