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AMD Confirms Zen 3 Brings Entirely Brand New CPU Architecture, Delivers
Significant IPC Gains, Faster Clocks & Higher Core Counts
By燞assan Mujtaba牋/牋Nov 19
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AMD's Senior Vice President,燜orrest Norrod,爃as unveiled some major details
of their next-gen Zen 3 CPU architecture in an interview with燭he Street.
According to Forrest, we can expect to see some major performance uplifts
with Zen 3 based products, coming from various factors such as new chip
architecture and an enhanced process node.
AMD Zen 3 A Bigger Improvement Than Zen 2 Thanks To New CPU Architecture
Delivering Higher IPC Gains, Clocks and More Cores
The AMD Zen 3 core architecture will be based on the 7nm+ process node &
will be the successor to the Zen 2 core architecture. AMD has already
confirmed that the design of the chip has been completed this year which
means that launch in 2020 is pretty much set at this stage. Now there are
some things we know about the architecture and somethings that we don't. Let
's start with what we know about the Zen 3 CPU architecture.
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AMD's CTO, Mark Papermaster,爎evealed back in late 2018爐hat the 7nm+ node
itself would help primarily leveraging efficiency with some modest
performance opportunities. AMD's EPYC Milan server lineup is one of the
confirmed products to be featuring the new Zen 3 core architecture & AMD has
爎eleased slides爏howing how their 7nm+ Milan lineup would offer higher
performance per watt compared to Intel's 10nm Xeon lineup aka Ice Lake-SP.
“TSMC may have been measuring a basic device like a ring oscillator — our
claims are for a real product,”
“Moore’s Law is slowing down, semiconductor nodes are more expensive, and
we’re not getting the frequency lift we used to get,” he said in a talk
during the launch, calling the 7-nm migration “
Looking ahead, a 7-nm-plus node using extreme ultraviolet lithography (EUV)
will “primarily leverage efficiency with some modest device performance
opportunities,”
via EE Times
Now燼ccording to TSMC爐hemselves, the 7nm+ process node allows an increase
of 20% in overall transistor density while increasing power efficiency by 10
%. AMD could take full advantage of the process node and we could see a
density boost of up to 20% in the Zen 3 architecture while having 10% better
power efficiency.Some of the details we know for燛PYC Milan CPUs爄nclude:
7nm+ Zen 3 cores (~64 core / 128 thread)Pin Compatible With SP3 Socket120W-
225W TDP SKUsPCIe 4.0 SupportDDR4 Memory SupportLaunch in 2020
So let's start with things we didn't knew until today. In the interview,
Forrest mentions that unlike Zen 2 which was an evolution of the Zen core
architecture, Zen 3 would be built completely from the ground up. This would
mean that we would be looking at very significant changes with the Zen 3
design unlike Zen 2 which looks and feels familiar but still managed to
deliver a solid 15% IPC up-lift which even AMD states were above
expectations.
When asked about what kind of performance gain Milan's CPU core
microarchitecture, which is known as Zen 3, will deliver relative to the Zen
2 microarchitecture that Rome relies on in terms of instructions processed
per CPU clock cycle (IPC), Norrod observed that -- unlike Zen 2, which was
more of an evolution of the Zen microarchitecture that powers first-gen Epyc
CPUs -- Zen 3 will be based on a completely new architecture.
Norrod did qualify his remarks by pointing out that Zen 2 delivered a bigger
IPC gain than what's normal for an evolutionary upgrade -- AMD has said it'
s about 15% on average -- since it implemented some ideas that AMD
originally had for Zen but had to leave on the cutting board. However, he
also asserted that Zen 3 will deliver performance gains "right in line with
what you would expect from an entirely new architecture."
- The Street
According to AMD, Zen 2 delivered 15% IPC while being an evolutionary design
. So going by that, if Zen 3 is an entirely new chip architecture, then we
can expect a bigger IPC uplift over Zen 2 with 3. This is also highlighted
by the fact that while the 7nm+ process node plays a smaller role in overall
performance uplift since the jump from 7nm to 7nm+ won't be as significant
as the jump from 14 nm to 7nm, it would deliver moderately higher clock
speeds and also better performance per watt which would be a key feature for
the new processors, especially against Intel's own 10nm lineup which is
also coming out next year in full force.
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AMD also confirmed that they will be following Intel's Tick-Tock cadence
which Intel seems to have completely abandoned. AMD states that like Intel,
a Tick would represent a new process node but similar architecture design as
the previous offering while a Tock would represent a brand new chip
architecture but with a similar or improved process node. This shows that
the Zen 3 architecture will be AMD's first proper Tock since the original
Zen core while the existing Zen 2 architecture is a Tick. The Zen+ cores can
also be considered a Tock but having a '+', they were more of a mid-term
solution that AMD offered with the then brand new 12nm process node.
As for the core count, AMD wants to keep pushing the boundaries with future
Zen architectures including Zen 3. Just like Zen 2 doubled the core count of
Zen, offering up to 64 cores and 128 threads, Zen 3 would also drive higher
core counts with improved nodes. AMD's chiplet design for Zen 2 is one of
the most advanced in the industry, offering high core counts at incredibly
good performance efficiency.
When asked about a response to Intel's 2.5D and 3D packaging methods which
their爊ew Ponte Vecchio Xe GPUs爓ould be utilizing, Forrest mentioned that
AMD is also exploring new 2.5DS and 3D packaging approaches for their future
chips but didn't mention an exact date as to when we would see those in
action.
"There's a number of application areas that just continue to benefit from
increasing core counts and increasing compute density," Norrod said. However
, he emphasized that AMD also wants to make sure that it takes "a balanced
approach" to increase things such as compute density, memory bandwidth, and
I/O connectivity so that additional horsepower isn't left "stranded" due to
a bottleneck elsewhere.
"You should expect we will continue to drive super hard on packaging
technology," he said. Norrod also pointed out that AMD爃as long used.5D
packaging to pair memory chips with its GPUs.
- The Street
AMD CPU Roadmap (2018-2020)Ryzen FamilyRyzen 1000 SeriesRyzen 2000
SeriesRyzen 3000 SeriesRyzen 4000 SeriesRyzen 5000 SeriesArchitectureZen (1)
Zen (1) / Zen+Zen (2) / Zen+Zen (3)Zen (4)Process Node14nm14nm / 12nm7nm7nm+
5nm/6nm?High End Server (SP3)EPYC 'Naples'EPYC 'Naples'EPYC 'Rome'EPYC '
Milan'EPYC 'Genoa'Max Server Cores / Threads32/6432/6464/128TBDTBDHigh End
Desktop (TR4)Ryzen Threadripper 1000 SeriesRyzen Threadripper 2000
SeriesRyzen Threadripper 3000 Series (Castle Peak)Ryzen Threadripper 4000
SeriesRyzen Threadripper 5000 SeriesMax HEDT Cores / Threads16/3232/6464/128
?TBDTBDMainstream Desktop (AM4)Ryzen 1000 Series (Summit Ridge)Ryzen 2000
Series (Pinnacle Ridge)Ryzen 3000 Series (Matisse)Ryzen 4000 Series (Vermeer
)Ryzen 5000 SeriesMax Mainstream Cores / Threads8/168/1616/32TBDTBDBudget
APU (AM4)N/ARyzen 2000 Series (Raven Ridge)Ryzen 3000 Series (Picasso 14nm
Zen+)Ryzen 4000 Series (Renior)Ryzen 5000 SeriesYear20172018201920202021?
As I said, AMD's current chiplet design is pretty advanced on its own and
has shaken giants such as Intel in the server and high-end desktop market.
They have a strong interconnect fabric known as Infinity Fabric which has
been deployed on all of their chips. As of now, AMD is getting very strong
demand for their 48 core and 64 core EPYC processors and while there have
been reports of 7nm TSMC production being constrained, AMD says that they
aren't much of an issue for AMD and they believe that they would absolutely
be able to supply whatever the market may demand.
As for the launch itself, AMD's EPYC Milan lineup is scheduled for the end
of 2020 but consumer end products would hit the market earlier. AMD's Zen 2
based Ryzen 3000 series processors were introduced in August so based on
that, we could see an announcement for the Zen 3 based Ryzen at Computex
2020, followed by a hard launch a few months later. Don't expect the
Threadripper parts based on Zen 3 anytime soon since AMD has yet to launch
theirrd Generation Threadripper series爄n the market with a 64 core part
being introduced next year in January.
How much IPC uplift over Zen 2 do you think Zen 3 architecture would offer?
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